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Sip System In Packaging Packaging Engineer Jobs

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SIP (System in Packaging) Packaging Engineer

Qualcomm
Hsinchu Taiwan
2-5 years

Company: Qualcomm Semiconductor LimitedJob Area: Engineering Group, Engineering Group > ASICS EngineeringQualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibil

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DFM process engineer

Apple
China Guangdong
8-11 years

Job Description Summary The Apple DFM (Design for Manufacturing) group is seeking an experienced professional with expertise in the area of semiconductor packaging processes. This engineer will assist in the development of assembly and packaging

IC Package EDA Engineer, Sr

Qualcomm
Taiwan Hsinchu
2-5 years

Company: Qualcomm Semiconductor LimitedJob Area: Engineering Group, Engineering Group > ASICS Engineering General SummarySummary Qualcomm's Package group is responsible for designing packages for various Qualcomm chipsets. This position is within th

Skills :

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