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System in Package (SIP) Design Engineer, Senior

Qualcomm
Taiwan Hsinchu
2-5 years

Skills :

Teller, SIP, SuZ

Standard Chartered
China
1-2 years

Skills :

Firmware/BIOS Validation Engineer

Intel
China Shanghai
Not Specified

Skills :

Package/System Design Engineer

Qualcomm
Hsinchu Taiwan
2-5 years

Skills :

Package Manufacturing Engineer

Qualcomm
Hsinchu Taiwan
10-15 years

Skills :

Support Engineer - Exchange

Microsoft
Taiwan
Not Specified

Support Engineer - Teams/Skype

Microsoft
China
Not Specified

Skills :

Supplier Quality Engineer-Packaging

Qualcomm
Taiwan
3-5 years

Skills :

RFFE Packaging Manufacturing Engineer, Sr. to Staff

Qualcomm
Hsinchu Taiwan
8-11 years

Skills :

SIP Technical Program Manager

Apple
China Guangdong
5-8 years

Manager, Disaster Recovery Management

Standard Chartered
China Shanghai
5-10 years

Skills :

Teller, SuZ SIP

Standard Chartered
China
1-2 years

Skills :

Supplier Quality Engineer-Packaging, Sr. to Staff

Qualcomm
Hsinchu Taiwan
3-5 years

Skills :

Package Design M/F

STMicroelectronics
China
Not Specified

Package Design M/F

STMicroelectronics
China
Not Specified

Sr. GCR Connect Specialist SA, Amazon Web Services

Amazon
China Beijing
7-10 years

Package Design M/F

STMicroelectronics
China
Not Specified

Package Design M/F

STMicroelectronics
China
Not Specified

SIP Management Supervisor

GlaxoSmithKline Pte Ltd
China Shanghai
Not Specified

Package Design M/F

STMicroelectronics
China
Not Specified

Package Design M/F

STMicroelectronics
China
Not Specified

IT Software Engineer

Flex
China
2-5 years

Skills :

Package Design M/F

STMicroelectronics
China
Not Specified
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