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IT Infrastructure Administrator

NexusCorp Limited
Hong Kong
5-10 years
Not Specified

Job Highlights:<br> * Administrator for overall IT infrastructure<br> * IT infrastructure project planning and execution

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Management Trainees for Myanmar Office

Company Name Confidential
Hong Kong
0-5 years
Not Specified

Management Trainees for work and intensive training in China, to be based in Myanmar.

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Packaging Engineer

AMD
Hsinchu Taiwan
Not Specified
Not Specified

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks

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APTD Data Scientist

Micron Semiconductor Asia Operations Pte. Ltd
Taichung Taiwan
Not Specified
Not Specified

Req. ID: 204647 The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Data Scientist in the Advanced Packaging Technology Development department, there are tons of data from

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Manager Packaging Engineering

AMD
Hsinchu Taiwan
Not Specified
Not Specified

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks

Skills :

- Bachelor Degree or above in any discipline <br> - IANG Graduates with Finance and Business discipline may apply for Financial Planner / Management Trainee<br> - Holders of valid HKID card or valid work permits including IANG<br> - Good communication skills,<br> - able to accept challenge<br> - Sales, Communicate to generate Leads and help to fix clients needs with financial products<br> - Great remuneration package with Basic Salary up to HK$25,000 + commission with Monthly Bonus and Year End Bonus<br> - Great sales incentives, Overseas Conference to Europe and Asian countries, whole family fringe benefits <br>

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Packaging Engineer (Package Design)

AMD
Hsinchu Taiwan
Not Specified
Not Specified

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks

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Req. ID: 138231Micron in Taiwan Micron's global footprint is designed to deliver comprehensive customer teamwork, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s pos

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Job Description : Job Description * This position presents an excellent opportunity for a highly motivated technical contributor to excel in substrate manufacturing process development for packaging at supplier's factories through Development, Ra

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Micron’s vision is to transform how the world uses information to enrich life for all.​Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help m

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78732_Packaging Engineer-Flip Chip Assembly/ Bumping

AMD
Jiangsu China
Not Specified
Not Specified

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks

Skills :

Packaging Engineer

Amazon
China
3-6 years
Not Specified

Job Description : Ring helps connect communities to build safer neighborhoods, and we are currently seeking a Packaging Engineer with strong conceptual and engineering skills to create unique, scalable concepts that drive the future of our packaging

Sourcing Manager

Amazon
China
7-10 years
Not Specified

Job Description : The Amazon Private Brands Global Sourcing team is looking for driven individuals to join the team. This role will be responsible for executing and improving the best practices in Global Sourcing. The interaction touches almost every

Packaging Engineer, Product Experience

Amazon
Taiwan
3-6 years
Not Specified

Job Description : Ring helps connect communities to build safer neighborhoods, and we are currently seeking a Packaging Engineer with strong conceptual and engineering skills to create unique, scalable concepts that drive the future of our packaging

Req. ID: 138606 Job Description We are looking for a high energy, driven leader with strong work ethic and integrity to join us as Global Quality (GQ) Sr. Director of Back End Central and Supplier Quality (BCSQ). This position will report directly to

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Engineer, Package RDA

Micron Semiconductor Asia Operations Pte. Ltd
Taichung Taiwan
3-6 years
Not Specified

Micron’s vision is to transform how the world uses information to enrich life for all.​Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help m

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Display Supply Chain Process Engineer

Intel
Shanghai Taiwan
5-8 years
Not Specified

Job Description : Job Description * Explores and benchmarks emerging technology in the industry. * Contributes in future technology definition and requirements. * Defines the technical requirements for supplier selection. * Works togethe

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Habana Package Engineer

Intel
Taiwan
5-8 years
Not Specified

Job Description : Job Description As part of your role you will: - Evaluate advanced package technologies for large packages provide risk assessment for next generation products. - Qualifies and recommends high end packaging technologies - Asse

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Experienced Quality Reliability Engineer

Intel
Liaoning China
3-6 years
Not Specified

Job Description : Job Description Develops, applies, and maintains quality and reliability standards for processing materials into partially finished or finished product. Evaluate the materials, process and techniques used in production to meet the

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PDE CEM Engineer

Micron Semiconductor Asia Operations Pte. Ltd
Taichung Taiwan
Not Specified
Not Specified

Req. ID: 238023 PDE CEM Engineer Job Description An Assembly PDE CEM Engineer is responsible for transfer, successful qualification and ramp to HVM on time of Micron memory packages (NAND, DRAM and NOR) in OSATs in Taiwan or other sites in Asia. T

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Req. ID: 197141 Job Description: As an Engineer in Micron’s Advanced Packaging Technology Development group at Taiwan Taichung, you will contribute at a high level as part of process technology team to develop deep sub-micron generation production-w

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Order management delivery operator

Siemens Technology
Shanghai China
2-3 years
Not Specified

Job Description : Job Responsibility: 1. Create customer orders in the ERP(SAP) system and determine the delivery dates (Check of delivery dates and confirmation, order confirmation to the customer) to fulfill the customer order at the requested

Planning coordinator intern

Intel
China
Not Specified
Not Specified

Job Description : Job Description Planning coordinator intern is responsible for planning ownership of a supply chain link. Responsibilities may include development, integration, optimization, coordination, communication and driving execution

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Logistics Intern

Intel
China
Not Specified
Not Specified

Job Description : Job Description We are looking for the passionate intern to support our logistics team in Chengdu. The ideal candidate will play an important role in helping developing and promoting department culture in respective areas. Design a

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Sourcing Manager

Amazon
China
2-5 years
Not Specified

Job Description : The Amazon Private Brands Global Sourcing team is looking for driven individuals to join the team from MBA programs across Asia. This role will be responsible for executing and improving the best practices in Global Sourcing. The in

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