Packaging And Product Development Jobs in Hsinchu
Job Description This position is associated with the sale of Intel's NAND memory and storagebusiness to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memor
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Job Description * Designs, develops, modifies and evaluates complex analog and mixed signal electronic parts, components or integrated circuitry for analog and mixed signal electronic equipment and other hardware systems. * Determines creative
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Job Description * Intel has manufacturing business with major foundries in the world. As a foundry technology expert, you will be driving transistor matching, spice model versus actual Si gap analysis, improvement to optimize product performance,
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Field Technology Director - (M6)
Applied Materials South East Asia Pte LtdAdvanced Packaging Field Technology leader with focus on expanding packaging business in a major foundry customer. Requires an individual who can think/act both strategically and tactically. Requires daily interaction with customers, business units,
Job Description This External Foundry Quality and Reliability Engineer position covers QnR of foundry suppliers to ensure that Intel branded IC's manufactured externally meet Intel quality and reliability requirements. You will be working with partn
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What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks
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Job Description Description * Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. *
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Packaging Business Development V - (B5)
Applied Materials South East Asia Pte LtdKey Responsibilities * BD Lead for advanced packaging technology development (Hybrid Bonding, Advanced Substrates, CoWoS) * Develop and execute strategies by Application, Market Size, Customer/product roadmaps * Work closely with customer as
Job Description * Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help
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Responsibilities: * Candidate will work closely with suppliers, peers, and customers to achieve customer satisfaction. * Ensure compliance to all NXP policies, procedures and standards to External Manufacturing quality * Will conduct regular
Manufacturing Quality Engineering - Supplier Quality Engineer (144926)
AMDWhat you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks
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[Job Description] Hsinchu City-1. Driver IC CP & FT test program development 2. New driver IC product verification 3. Driver IC mass production exception support 4. Product reliability/low yield analysis 5. Fresh and inexperienced students are welcom
[job content] Hsinchu City-SOC testing Engineering: 1 .Test program development 2. Test accessory design 3. Product function verification 4. Mass production yield improvement 5. Requirements: 5-1. With more than 2 years of test program development ex
[Job Description] Hsinchu City-1.LCD Driver Product electrical verification (writing test machine program) 2. LCD Driver mass production program development (writing test machine program) 3. Mass production maintenance and troubleshooting 4. Requirem
[Job Description] Hsinchu City-1. Perform test Analysis of production data (data-log) to solve mass production engineering problems, improve production efficiency and stabilize product yield. 2. Perform engineering and technical audits of outsourced
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Job Description * Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Respo
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Job Description As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders. Your key responsibilities include: 1) Drive in-depth post-Si optimization in the post-
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Job Description As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders. Your key responsibilities include: 1) Leading cross-functional teams across different r
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Advanced Packaging Development and Integration Project Manager(157744)
AMDWhat you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks
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Advanced Packaging Development and Integration Project Manager(157745)
AMDWhat you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks
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What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks
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What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks
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Job Description This is an exciting time to be at Intel, come join our NAND DESIGN TECHNOLOGY and MANUFACTURING team as a Sr Product Development Engineer and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in
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Job Description * Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Respo
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