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Packaging And Product Development Jobs in Hsinchu

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41 Jobs

Product Development Engineer

Intel
Taiwan Hsinchu
3-6 years

Job Description This position is associated with the sale of Intel's NAND memory and storagebusiness to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memor

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Sr. Analog Mixed Signal Engineer

Intel
Taiwan Hsinchu
8-11 years

Job Description * Designs, develops, modifies and evaluates complex analog and mixed signal electronic parts, components or integrated circuitry for analog and mixed signal electronic equipment and other hardware systems. * Determines creative

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Foundry Product Engineer

Intel
Taiwan Hsinchu
8-11 years

Job Description * Intel has manufacturing business with major foundries in the world. As a foundry technology expert, you will be driving transistor matching, spice model versus actual Si gap analysis, improvement to optimize product performance,

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Advanced Packaging Field Technology leader with focus on expanding packaging business in a major foundry customer. Requires an individual who can think/act both strategically and tactically. Requires daily interaction with customers, business units,

External Foundry Quality & Reliability Engineer

Intel
Taiwan Hsinchu
5-8 years

Job Description This External Foundry Quality and Reliability Engineer position covers QnR of foundry suppliers to ensure that Intel branded IC's manufactured externally meet Intel quality and reliability requirements. You will be working with partn

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Product Development Eng.(164565)

AMD
Taiwan Hsinchu
Not Specified

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

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NPI Manager

Intel
Taiwan Hsinchu
15-18 years

Job Description Description * Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. *

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Key Responsibilities * BD Lead for advanced packaging technology development (Hybrid Bonding, Advanced Substrates, CoWoS) * Develop and execute strategies by Application, Market Size, Customer/product roadmaps * Work closely with customer as

Packaging Engineer

Intel
Taiwan Hsinchu
10-15 years

Job Description * Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help

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OSAT Quality

NXP Semiconductors India Private Limited
Hsinchu Taiwan
10-13 years

Responsibilities: * Candidate will work closely with suppliers, peers, and customers to achieve customer satisfaction. * Ensure compliance to all NXP policies, procedures and standards to External Manufacturing quality * Will conduct regular

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

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IC test Engineer-Driver (T1)

Novatek Microelectronics
Hsinchu Taiwan
Not Specified

[Job Description] Hsinchu City-1. Driver IC CP & FT test program development 2. New driver IC product verification 3. Driver IC mass production exception support 4. Product reliability/low yield analysis 5. Fresh and inexperienced students are welcom

IC test engineer -SOC (T1)

Novatek Microelectronics
Hsinchu Taiwan
2-5 years

[job content] Hsinchu City-SOC testing Engineering: 1 .Test program development 2. Test accessory design 3. Product function verification 4. Mass production yield improvement 5. Requirements: 5-1. With more than 2 years of test program development ex

IC test Engineer-Driver (T1)

Novatek Microelectronics
Hsinchu Taiwan
Not Specified

[Job Description] Hsinchu City-1.LCD Driver Product electrical verification (writing test machine program) 2. LCD Driver mass production program development (writing test machine program) 3. Mass production maintenance and troubleshooting 4. Requirem

[Job Description] Hsinchu City-1. Perform test Analysis of production data (data-log) to solve mass production engineering problems, improve production efficiency and stabilize product yield. 2. Perform engineering and technical audits of outsourced

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Packaging Engineer

Intel
Taiwan Hsinchu
5-10 years

Job Description * Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Respo

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Yield Management Engineer

Intel
Taiwan Hsinchu
15-18 years

Job Description As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders. Your key responsibilities include: 1) Drive in-depth post-Si optimization in the post-

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Yield Management Engineer

Intel
Taiwan Hsinchu
15-18 years

Job Description As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders. Your key responsibilities include: 1) Leading cross-functional teams across different r

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What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

Skills :

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

Skills :

Packaging Engineer - Yield Integration (150943)

AMD
Taiwan Hsinchu
Not Specified

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

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SMTS Silicon Design Engineer

AMD
Hsinchu Taiwan
12-15 years

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

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Product Development Engineer

Intel
Hsinchu Taiwan
6-9 years

Job Description This is an exciting time to be at Intel, come join our NAND DESIGN TECHNOLOGY and MANUFACTURING team as a Sr Product Development Engineer and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in

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Packaging Engineer

Intel
Hsinchu Taiwan
10-13 years

Job Description * Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Respo

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