Microelectronics Jobs
Job Description: Application Engineer We are looking for a Application Engineer to join Arrow company, in Beijing office. The main purpose of the position is to drive demand creation by maximizing Arrow content on designs. Understand customer needs
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Job Description: Application Engineer We are looking for an Application Engineer to join Arrow company, in Beijing office. The main purpose of the position is to drive demand creation by maximizing Arrow content on designs. Understand customer needs
Skills :
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help
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Job description: 1.Applications development based on NXP MCU and MPU. 2.Documenting design and technical application documents. 3.Support systems engineer for general applications and segment applications. 4.Platform benchmark for MCU or MPU. Qualifi
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Job Description: Deliver/implement DDR IP. The engineer should be able to act as a strong team member and contributor, leading team project
Key Responsibilities： * To accomplish annual/quarter sales, margin(within cost control) and collection targets, try the best to excess. * Visit the customers in responsible area and build close business relationship with them. Record customer i
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Job requirements * Understand SGT MOS, Cool MOS, trench MOS principles. * Understand power device process * Familiar with TCAD, like Sentaurus * Familiar with Layout tools, like Virtuoso * Understand FMEA,QFD,DOE,SPC,8D,FA knowledg
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Test Product Engineer in Final Test quit for new opportunity. ATTJ Final Test engineering team need a new recruit to replace him. Test Product Engineer is key position to drive the key manufacturing KPIs: 1, work on the test time reduction and test i
Responsibilities 1. Responsible for company chips The front-end/back-end verification of the project mainly focuses on the coverage-driven in-depth verification of the self-developed IP 2. Responsible for the formulation of the verification plan, env
The Role 1. Technical degree in one of the following subjects: Chemistry, Physics, Mechanical Engineering, Microelectronics or significant experience in the semiconductor industry 2. Sales and negotiation skills 3. Good commercial and techni
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What you will do * Develop discrete ESD and TVS protection devices via subcons * Take the lead for the product architecture and performance in development projects * Take the lead for development projects * Align requirements from custome
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Quantum Dot Light Emitting Diode (QLED) Device Development Engineer (J31697)
BOE TechnologyJob Responsibilities 1. Engage in device design, optimization and corresponding processes of quantum dot light-emitting diode (QLED) devices Development, responsible for the test characterization, mechanism analysis and standard formulation of QLED d
Quantum Dot Light Emitting Diode (QLED) Device Development Fellow (J31699)
BOE TechnologyJob Responsibilities 1. Engage in device design, optimization and corresponding processes of quantum dot light-emitting diode (QLED) devices Development, responsible for the testing and characterization, mechanism analysis and standard formulation of
Job Description Design of CPU Subsystem IPs including micro architecture, logic design, LINT, Clock Domain Crossing Analysis, UPF, LEC, Synthesis, ATPG, overseeing all verification, backend implementation and validation aspects of the IP etc. Your
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Job Responsibilities 1. Master the semiconductor industry information, be familiar with the intelligent manufacturing factory (MES, WMS, SPC, etc.) system, and the industry Clients communicate information system construction plans, and report product
Job Responsibilities 1. Assist in the construction of sensing technology platform and process development 2. Participate in the demonstration of relevant sensing projects and form implementable technical solutions 3. Sense direction related new techn
General information KEY INFORMATION: STMicroelectronics is a leading semiconductor company, a world key player thanks to our 43,200 employees including 8,300 working in R&D. ST's products are found everywhere today. And together with our customers,
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help
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Responsibilities 1. Responsible for SoC system Design, including: defining spec, SoC integration, IP selection and RTL design 2. Participate in SoC clock/reset/low power/debug design 3. Support SoC verification and software development and debugging.
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Responsibilities 1, CPU/ ASIC chips, from Netlist to GDSII, including signoff work such as APR and PV/STA/IR 2. As an interface person, participate in chip tapeout, mass production, packaging and testing, quality control, etc. 3. Early evaluation of
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Responsibilities 1 Basic digital IP commonly used in designing chips 2. The IP involved includes: standard unit (area or power consumption) with special optimization direction, custom SRAM, big inverter, dynamic latch and other small digital IP 3. C
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Your vision is ambitious. Just like ours. Our people are our success. As one of us, you will contribute to engineering excellence for the high-tech markets of the future, including semiconductors, batteries, pharmaceuticals, biotechnology, and data
Responsibilities 1. Provide chips Package design scheme: including package selection, package design, package implementation, PinMap definition, board-level interconnection 2. Connect with chip designers and board-level designers to deal with interfa
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Responsibilities 1, CPU/ ASIC chips, from Netlist to GDSII, including signoff work such as APR and PV/STA/IR 2. As an interface person, participate in chip tapeout, mass production, packaging and testing, quality control, etc. 3. Early evaluation of
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Responsibilities 1, CPU/ ASIC chips, from Netlist to GDSII, including signoff work such as APR and PV/STA/IR 2. As an interface person, participate in chip tapeout, mass production, packaging and testing, quality control, etc. 3. Early evaluation of
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