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113 Jobs

Analytical Test Engineer II, Zhangjiagang, ADM, PMT

Honeywell
China Jiangsu
3-6 years

Responsibilities Responsible for routine analysis and characterization of Refrigerant, foam, fibers, coating, and chemicals Actively be participate R&D projects to support business growth, sourcing, customer issue resolution and competitor analysis e

Mechanical Engineer - Probe Card Design

Qualcomm
Hsinchu Taiwan
1-4 years

Company: Qualcomm Semiconductor LimitedJob Area: Engineering Group, Engineering Group > Hardware Engineering General SummaryQualcomm Technologies Inc. is focused on inventing technologies that connect and empower people in ways that are elegant and a

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TD Product Reliability engineer

Intel
Liaoning
5-8 years

Job Description

Focus on new product and technology development phase product quality and reliability spec definition through cross functional team's work and alignment
Lead reliability defect reduction roadmap in development phase to enable product

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Analytical Test Engineer II, Zhangjiagang, ADM, PMT

Honeywell
China Jiangsu
3-6 years

Responsibilities Responsible for routine analysis and characterization of Refrigerant, foam, fibers, coating, and chemicals Actively be participate R&D projects to support business growth, sourcing, customer issue resolution and competitor analysis e

Skills :

Passive Engineer

Intel
Taiwan Malaysia
5-8 years

Job Description * This role is within the Systems Supply Chain and Technology Enabling (SSC) Organization. The engineer will need a deep background in component engineering with a focus on Passive components. * This engineer will be required to

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Job Description : Job summary Ring is a leader in developing security products, such as doorbells, spotlights, alarms and cameras. Our Product Integrity team aims to develop reliable and robust products that delight our customers. Ring is looking for

Thinfilm Engineer

Intel
China Liaoning
Not Specified

Job Description Process Engineers for thin film, develop and sustain processes of thin film deposition in semiconductor fab manufacturing operations. Plans and implements capacity, and operational improvements to maximize output while improving the

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Job Description In your new role you will: * * In charge of material qualification projects for cost reduction and secure supply with an overview understanding of semicondutor assembly and testing packing material, process and equipment. *

Test Engr II, Zhangjiagang, ADM, PMT

Honeywell
China Jiangsu
3-6 years

Responsibilities Responsible for routine analysis and characterization of Refrigerant, foam, fibers, coating, and chemicals Actively be participate R&D projects to support business growth, sourcing, customer issue resolution and competitor analysis e

Skills :

Scientist, advanced material and system research

BASF
China Shanghai
6-9 years

We are a leading chemical company, with the best teams developing intelligent solutions for our customers and for a sustainable future. Our success as a company relies on the engagement of our employees. We encourage our employees to develop their st

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Company: Qualcomm Semiconductor LimitedJob Area: Engineering Group, Engineering Group > ASICS Engineering General SummaryWe are looking for a highly motivated packaging engineer capable of leading state-of-the-art Flip Chip technology projects. You w

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Senior Wire Bonding Engineer

Nexperia
China Guangdong
5-8 years

About the Role: the role is in package R&D dept. working as Wire bonding process development engineer. What you will do: * Able to develop a good process characterization for new package and process technology. * Provide technical sol

Job Description In your new role you will: . Drive a Packaging team for New Package Development from Development Process post concept approval to launch . Responsible to ensure all New Package Development is within timeline and budget and Technical &

Senior Product Characterization Engineer

Nexperia
China Guangdong
Not Specified

About the Role: Setup and develop semiconductor product characterization measurement. What you will do: * Responsible to setup the semiconductor product characterization measurement of Diode, transistor, MOSFET, etc. * Responsible to perform pr

SIP (System in Packaging) Packaging Engineer

Qualcomm
Hsinchu Taiwan
2-5 years

Company: Qualcomm Semiconductor LimitedJob Area: Engineering Group, Engineering Group > ASICS EngineeringQualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibil

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Research Scientist

CORNING
Taiwan
Not Specified

Corning is one of the world's leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise in specialty glass, ceramics, and optical physics to develop products that have created new industries and

Sr. Mechanical and Reliability Scientist

CORNING
Taiwan
Not Specified

Corning is one of the world's leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise in specialty glass, ceramics, and optical physics to develop products that have created new industries and

Sr. Mechanical and Reliability Scientist

CORNING
Taiwan
2-5 years

Corning's Display Technologies segment manufactures glass substrates for active matrix liquid crystal displays ('LCDs') that are used primarily in LCD televisions, notebook computers and flat panel desktop monitors. Day to day responsibilities: *

Design Engineer (IGBT)

Nexperia
China Shanghai
Not Specified

What you will do * Be responsible to perform detailed process and device simulations using advanced TCAD tools from concept through product release, to enable successful power IGBT/GaN technology development projects * Collaborate with diverse

Sr. Process Engineer

CORNING
China Shanghai
Not Specified

Corning is one of the world's leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise in specialty glass, ceramics, and optical physics to develop products that have created new industries and

Job Description In your new role you will: 1. Part of Infineon's Product & Test Engineering team (PTE), which has followership of MOSFET, IGBT, SiC, IC and Multi-Chip Module (MCM) products as they are released to manufacturing at OSAT/Subcons and Mex

Sr. Chip Design Mgr.

Nexperia
China Shanghai
3-5 years

About the role The experienced candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will work with high power chip technology development team to design and develop advanc

Engr, Apps Dev 3

KLA-Tencor Software (India) Pvt Ltd
China Shanghai
Not Specified

Company OverviewKLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controll

SR ENGINEER, TTC WET

Micron Semiconductor Asia Operations Pte. Ltd
Taichung Taiwan
5-8 years

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help

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