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Package/System Design Engineer

Qualcomm
Hsinchu Taiwan
2-5 years

Skills :

Senior Software Engineer

GE Healthcare
China Jiangsu
5-8 years

Skills :

UX Design Lead

HSBC
China Guangdong
7-10 years

Skills :

Senior Software Engineer

GE Healthcare
China Jiangsu
5-8 years

Skills :

Spice model Engineer, Staff to Sr Staff Engineer

Qualcomm
Taiwan Hsinchu
3-6 years

Skills :

Cloud Firmware Engineer

Intel
China Shanghai
3-6 years

Skills :

Sr. Manufacturing Design Engineer

Amazon
China
5-8 years

Skills :

Senior SW Solution Designer,Shanghai,HCE,CEHC

Honeywell
China Shanghai
5-6 years

Software Developer

Siemens Technology
China
5-8 years

Skills :

Consultant Specialist

HSBC
China Guangdong
7-10 years

Engineer,Senior

Qualcomm
China
2-5 years

Skills :

Engineer, Senior (IE)

Qualcomm
China
2-5 years

Skills :

NPI Engineer

Qualcomm
China
2-5 years

Skills :

Assistant Project Manager - Hang Seng Bank (HK)

HSBC
Hong Kong
Not Specified

PMIC Product Test Engineer, Senior

Qualcomm
Taiwan Hsinchu
1-4 years

Skills :

Workplace Manager - Hang Seng Bank (HK)

HSBC
Hong Kong
8-10 years

Full Stack Engineer - Digital Business Services

HSBC
Hong Kong
Not Specified

Skills :

Sr. Camera Test Engineer

Amazon
China
7-10 years

Product & Test Development Engineer (Sustained)

Qualcomm
Taiwan Hsinchu
1-7 years

Skills :

Sr. Camera Test Engineer

Amazon
China
7-10 years

Sr. Camera Test Engineer

Amazon Web Services (AWS)
China
7-10 years

Sr. Camera Test Engineer

Amazon Web Services (AWS)
China
7-10 years

Sr. Manufacturing Design Engineer

Amazon
China
5-8 years

Skills :

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