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Thermal & Mechanical Engineer

Hewlett Packard Enterprise
Taiwan Taipei City
0-2 years

Thermal & Mechanical Engineer This role has been designated as ‘Office, which means you will primarily work from an HPE office. Job Description: Hewlett Packard Enterprise advances the way people live and work. We bring together the brightest mind

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3D NAND TD Principle Engineer

Intel
China Liaoning
Not Specified

Job Description Intel Dalian is rapidly expanding its 3D NAND Dalian Technology Development (DTD) organization to develop future generations of 3D NAND process technologies. This job requisition is to seek an experienced candidate to lead the 3D NA

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DMTM PIE2 Equipment Engineer

Intel
China Liaoning
2-5 years

Job Description RDA Equipment Engineer are responsible for managing the technical aspects of equipment and vendor engagement and area tool installations relocations retrofits activities As well as optimizing existing tool performance. Additional res

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Technology Development CMOS Integration Engineers

Intel
China Liaoning
3-6 years

Job Description Dalian 3D NAND TD team is seeking for strong candidates for the positions of Technology Development CMOS Integration Engineers. The selected candidate will lead efforts to drive CMOS scaling and performance enhancement within the bro

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DTD technology development process engineer

Intel
China Liaoning
3-6 years

Job Description Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing facility, while starting-up a new Dalian Technology Development (TD) organization to develop future generations of 3D NAND process technologies. And now we are

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Data Center Power Platform Application Engineer

Intel
Taiwan
Not Specified

Job Description Signal Integrity Engineer Under Data Center Platform Application Engineering (DCPAE is an engineering team in data Platform Group (DPEA). The scope of the signal integrity team is working on customer high-speed I/O enabling and suppor

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Packaging Engineer for high performance computing products

Intel
Taiwan Hsinchu
5-8 years

Job Description * Microelectronic Packaging Engineers provide project management, package design/development and support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Responsib

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HR partner

Intel
China Liaoning
10-13 years

Job Description Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory

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Engineer (Cluster level)

Ikea
China Shanghai
Not Specified

WHAT YOU'LL NEED TO HAVE . Project management: Knowledge of how to initiate, plan, execute, control and close a project. . Construction management: Knowledge of how to initiate, plan, organize, execute and manage the construction of Ingka properties

TD process integration Engineer

Intel
China Liaoning
Not Specified

Job Description Dalian 3D NAND TD team is looking for an CMOS Integration engineer candidate. As a PI engineer, you will be responsible to enable next generation non-volatile memory CMOS segment integration schemes, and 3D-NAND CMOS density and perf

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HR partner

Intel
China Liaoning
10-13 years

Job Description Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory

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HR partner

Intel
China Liaoning
10-13 years

Job Description Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory

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Senior probe/test engineer

Intel
China Liaoning
Not Specified

Job Description Qualified candidate is responsible for developing and maintaining wafer level functional test strategies and programs developing innovative solutions for production test flows interface hardware and test equipment. Your responsibilit

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Visual Designer, GPS CN

Amazon
China Beijing
3-6 years

DESCRIPTION Job summary Global Production Service (GPS) is a global, internal creative agency. As a team sits globally, we support consumer marketing teams design and video production needs across 20 marketplaces, we focus on scalability through th

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DTD DFM Process Champion

Intel
China Liaoning
Not Specified

Job Description This job requisition is to seek strong candidates for DFM (Design For Manufacturing) Process Champion. The selected candidates will primarily work on 3D NAND N+1 technology, partner with DTD PE team and HVM Alpha PE team to gain earl

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DTD DFM Process Champion (Diffusion)

Intel
China Liaoning
Not Specified

Job Description This job requisition is to seek strong candidates for DFM (Design For Manufacturing) Process Champion. The selected candidates will primarily work on 3D NAND N+1 technology, partner with DTD PE team and HVM Alpha PE team to gain earl

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DTD DFM Process Champion (Wet Process)

Intel
China Liaoning
Not Specified

Job Description This job requisition is to seek strong candidates for DFM (Design For Manufacturing) Process Champion. The selected candidates will primarily work on 3D NAND N+1 technology, partner with DTD PE team and HVM Alpha PE team to gain earl

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DTD DFM Process Champion (Dry Etch)

Intel
China Liaoning
Not Specified

Job Description This job requisition is to seek strong candidates for DFM (Design For Manufacturing) Process Champion (Dry Etch). The selected candidates will primarily work on 3D NAND N+1 technology, partner with DTD PE team and HVM Alpha PE team t

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DTD DFM Process Champion (Thin Film)

Intel
China Liaoning
Not Specified

Job Description This job requisition is to seek strong candidates for DFM (Design For Manufacturing) Process Champion. The selected candidates will primarily work on 3D NAND N+1 technology, partner with DTD PE team and HVM Alpha PE team to gain ear

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DTD Yield Engineer

Intel
China Liaoning
2-5 years

Job Description DTD Yield Engineer is going to be responsible for driving understanding and resolution of die yield limiting issues of new 3D NAND technologies through data analysis, DOE and fab process optimization, by working across different func

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Sr. TPM (Hardware), ComPAS

Amazon
China
7-10 years

DESCRIPTION Job summary This is a unique opportunity to create exciting consumer products in a start-up like team. You will drive high impact decisions, enjoy being part of fast pace execution and get an opportunity to work with best of engineers an

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Engineer (Electrical)

Ikea
China Shanghai
Not Specified

WHAT YOU'LL NEED TO HAVE . Project management: Knowledge of how to initiate, plan, execute, control and close a project. . Construction management: Knowledge of how to initiate, plan, organize, execute and manage the construction of Ingka properties

西门数控 机械设计工程师

Siemens Technology
China Nanjing
5-8 years

Job Description : What are my responsibilities Develop and implement mechanical concepts based on appropriate evaluations for Drive and NC products during product development process 负责驱动和数控类产从概念到产的结构设计方案 Execute structural and thermal calculatio

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DTD Thin Films Deposition Area Manager

Intel
China Liaoning
10-13 years

Job Description INTEL NAND TD at Intel Dalian is technology development organization to develop future generations of 3D NAND process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capa

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DTD Litho department Director

Intel
Liaoning
10-13 years

Job Description

INTEL NAND TD at Intel Dalian is technology development organization to develop future generations of 3D NAND process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capa

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