TD Quality engineer

TD Quality engineer

5-8 years
Not Specified

Job Description

Job Description :
Job Description
Focus is on new the product and technology development phase, product quality and reliability spec definition and ensuring that the product development meets the quality requirement. Lead the intrinsic reliability roadmap during the development phase to enable product qualification, including process resolutions, test screen methodologies or system level solutions. Develop wafer level test flows for product quality and reliability, with measurements to expedite the learning cycle for the new product process development. Responsible for monitoring the reliability performance, segment and understand any fail mode through data analysis, modeling and electrical failure analysis (EFA). Responsible for unit level intrinsic reliability early projections at wafer level to speed up the TD process development learning cycle. Perform process commonality analysis through data mining for high risk mechanisms to identify process root cause and work with cross functional teams to establish a resolution path. Perform new defect mode characterization using novel acceleration methods to assure early identification of potential problems in TD phase. Lead cross functional teams to solve critical technical problems through the various phases of the product development, manufacturing and ramp up. Evaluate TD phase process changes to ensure there is no quality and reliability impact through reliability data collection and analysis, including risk assessment data collection plan and execution
Master or PHD with major in electrical, chemistry, physics, material and engineering
Minimum 5 years working experience in related filed is preferred, such as fab process process integration yield analysis, test engineer, product or quality and reliability roles
Good understanding of device physics, PN junctions and MOSFET operations
Hands on experience with electrical failure analysis is preferred
Scripting experience and interest in python, perl or other similar languages are preferred
Reliability statistical knowledge is preferred
Hands on experience in large volume data analysis is preferred
Basic knowledge on analog and digital circuit design is add on
Direct NAND experience is add on
Cadence Hspice Verilog simulation tool experience is add on
Strong analytical and problem solving skills
Experience in leading cross-functional teams is preferred
Passion in product and process development phase failure mode debug characterization
Good communication skills in English
This position is associated with the sale of Intel's NAND memory and storage business to SK Hynix. You can read more about the transaction in the press release. The transaction will enhance the resources and potential of the business storage solutions including client and enterprise SSDs in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel: come join our NAND DTM group and work on the most advanced 3D NAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products and you will be part of a world class team that will transition to lead the SSD business at SK Hynix
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development, along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to SK HynixInside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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