Substrate Module Development Integration Engineer

Substrate Module Development Integration Engineer

Intel
Taiwan
8-11 years
Not Specified

Job Description


Job Description :
Job Description
  • This position presents an excellent opportunity for a highly motivated technical contributor to excel in substrate manufacturing process development for packaging at supplier's factories through Development, Ramp, and High Volume Manufacturing (HVM) phases.
  • Substrate process development include various technologies for Patterning, Lithography, Development, Plating, Dielectric Formation, Surface Finish, Surface Treatment and Planarization.
  • Work together with supplier and internal partners for technology transfer, fingerprinting & benchmarking across manufacturing tools and chemicals, planning & execution of process window characterization and validation, validation of process control plan and FMEA, improvement of process control system and process development methodology.
  • Develops solutions to technical problems and systemically closes the problems to ensure smooth Ramp and HVM of the new substrate technology.

Qualifications
Qualifications:
1.BS, MS, or PhD in Science or Engineering fields with minimum 8 years experiences in Semiconductor (Fab, Substrate, Packaging) development or manufacturing environment is required.
2.Strong skill required for Supplier Management, Quality Management, Analytical Problem Solving, and Influence in relevant fields of Technology Development and Ramp.
3.Highly experienced in managing Fab or Substrate factory operations for manufacturing, process control, preventive maintenance of the manufacturing lines are required.
4.In-depth knowledge required on Substrate Manufacturing Processes, Raw Materials, Packaging Technologies, and Quality & Process Control Systems.
5.Knowledgeable in Cleanroom operations and Foreign Material control are preferred
6.Fluent communication in business level English communication preferred, excellent Presentation skill, good Stakeholder Management, ability to work in cross-functional teams are required.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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