引线框架-装研工程师(都)/SC Packaging Engineer

引线框架-装研工程师(都)/SC Packaging Engineer

The Texas Instruments Foundation
Not Specified
Not Specified

Job Description



About TI
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We're committed to building a better future - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us - change the world, love your job!

About the job
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.

Responsibilities may include:

  1. Will work as a Design Engineer responsible for lead frame design, package outline design, LF code and product content

  2. New product design rule compatibility review/gating, maintain and enhancing packaging design rule and capability

  3. Drive lead frame supplier capability enhancement and optimization, open up design or process constraints do stay competitive Support new lead frame supplier audit and qualification. Integration of supplier capability, lesson learned and design guidelines.

  4. Collaborate with TI business group, internal /Ops partners as well as with suppliers for lead frame design improvement, new products and SC Packaging projects.


Requirements:
1. Highly competent in AutoCAD design software, competent in power point and excel software.
2. Analytical skills for problem troubleshooting and root cause investigation.
3. Competent in Geometric Dimensioning and Tolerance (GD&T)
4. Good oral and written communication skills especially in English.
5. Good team work spirit and self-driven.
Others:(not necessary but will be an advantage if knowledgeable)
1. Knowledge on APQP.
2. Use of statistical software (like JMP)
3. Understanding of reliability testing and failure analysis specifically for flip chip devices.
4. Understanding of material science of solder systems.

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