Packaging Engineer

Packaging Engineer

NXP Semiconductors India Private Limited
Tianjin China
Not Specified
Not Specified

Job Description

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.
Job Summary:
  • Focusing on FCCSP (Flip Chip CSP) package process development
  • Define and validate package designs, materials and processes used for development of new products for NXP.  Develop DOE’s and tests to evaluate suitability and reliability of package solutions.  Work with the Business Lines and the factories (both internal to NXP and OSAT) to qualify the package/product solutions.
  • Manage the package process using industry standard project management tools.
  • Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
  • Address and solve materials and processing issues that may occur during the development process.
  • May involve international travel to package assembly sites and NXP suppliers.

Job Qualifications:
  • 35 years of FCCSP package/process development work experience is highly preferred
  • Bachelor or Master degree in Mechanical Engineering, Automation Engineering or Chemical Engineering
  • CET-6 equivalent or above is preferred
  • Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
  • Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
  • Knowledge of Statistical Analysis and Design of Experiment is a plus.
  • Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

Thank you for considering a career at NXP. To help you prepare for the different steps in our hiring process, please see the following useful advice and tips.Are you already an NXP employee Do not apply here. Instead, you can apply via our internal career page (this intranet link is only available from NXP sites or with VPN).

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