Litho Process Engineer

Litho Process Engineer

Intel
Not Specified
Not Specified

Job Description


Job Description :
Job Description
Process Engineers develop and sustain such processes as diffusion etching plating lithographic printing thin film deposition in semiconductor fab manufacturing operations Plans and implements capacity and operational improvements to maximize output while improving the safety and quality of operations As module owner conducts tests and measurements of their operations to determine control over critical dimensions and defectivity of the process line Recommends and implements modifications for operating the equipment in order to improve production efficiencies manufacturing techniques and optimizing production output for existing products Establishes and submits processing requirements to be met in designing and acquiring processing equipment Exercise independent judgement and discretion by making recommendations and adjusting tools and processes reactively when something has changed on the line or proactively in order to maximize output Develops solutions to problems utilizing formal education and judgement.
This position is associated with the sale of Intel's NAND memory and storagebusiness to SK Hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel - come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix.
Qualifications
About DMTM Intel will produce its latest 3D NAND technology at our F68 site with initial production expected in the second half of 2016 Intels manufacturing site in Dalian has achieved world class operations and expertise F68 has been in operation since 2010 producing 65nanometer products for Intel The collaboration with the Dalian government has been and continues to be an excellent partnership We have a long term plan for this facility and may invest up to 55 billion over the coming years to transition this site to support leading edge nonvolatile memory production This new business investment will make Intel Dalian Intels first global integrated circuits manufacturing center for leading edge 300mm nonvolatile memory products and is a natural evolution to Intels Dalian site Litho process engineer is responsible for transferring new product to production Fabs and directing the sustaining improvement efforts for yield and equipment performance
Good data mining skills
Effective communication skills in both written and spoken English
Good multitasking and organizational skills
Problem solving and analytical skills
Strong data analysis Verilog experience
Effective presentation skills
Ability to lead cross functional teams for issue resolutions
A good Team player
Must possess a Bachelor MS or PhD in Electrical Engineering Materials Science Physics Chemistry or Chemical EngineeringInside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

About Intel

Job Source : jobs.intel.com

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