HBM TD Process Integration/ Senior/ Principal Engineer

HBM TD Process Integration/ Senior/ Principal Engineer

Micron Semiconductor Asia Operations Pte. Ltd
Not Specified
Not Specified

Job Description



Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR14663 HBM TD Process Integration/ Senior/ Principal Engineer
As a Process Integration engineer within our Technology Development organization at Micron Technology, you will be part of a world-wide advanced packaging team responsible for next generation high bandwidth memory (HBM-DRAM) pathfinding and development. You will be responsible for vertical integration efforts across FABs, wafer level packaging and assembly unit processes.Roles & Responsibilities:

  • Drive design of experiments (DOEs) and analysis with tenacity in creating a process technology path towards definition of leading HBM products in the market

  • Define test vehicle (TV) for process development and characterization, co-work with designers and ensure a process technology aware design

  • Derive construction specification (CSPEC) and establish process integration flow best known methods (BKMs) for TV, test chip and product

  • Collaborate with cross functional teams for demonstration and development of advanced packaging technology

  • Engage with external vendors and research partners in expediting the process development and interception on Micron TVs

  • Model-based problem solving and lead innovation efforts through risk/ issues mitigation, patents, and papers

  • Tactical management of integration LOTs, travelers, and ensure smooth transition across key process steps
Experience requirements:

  • Prior integration experience of 3D TSV, Micro-bumps, temporary bonding/ debonding, wafer thinning, BS TSV reveal, RDL, dicing and hybrid bonding is required

  • Knowledge of FAB/ BEOL Cu interconnects, and BE/ CoWoS and Fan-Out WLP is preferred

  • Understanding of semiconductor devices, processes, and characterization techniques is required

  • Basic understanding of Customer needs with a focus in the Memory segment

  • Oral and written English communication
Education requirements:

  • Bachelor's Degree or higher in a relevant Engineering discipline - Electrical, Microelectronics, Material Science, Chemical, Physics, Mechanical or related disciplines

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact at .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Job Details

Micron is a world leader in innovative memory solutions that transform how the world uses information. We have approximately 40,000 team members in 17 countries who work with the world's most trusted brands, delivering memory and storage systems for a broad range of applications and sparking countless possibilities in technology..

Job Source : micron.eightfold.ai

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