Design/DFM Integration Engineer

Design/DFM Integration Engineer

3-6 years
Not Specified

Job Description

Job Description :
Job Description
The Intel DMTM Technology Development team is responsible for developing state of the art NVM (Nonvolatile Memory) technologies (e.g. 3D-NAND). As a Design/DFM Integration Engineer, you will be responsible for product/test-chip tape-outs from start to finish including design rules verification (layout rules, sanity rules, mask rules, scribe rules, etc), Design for manufacturability of die layouts and circuits, and mask data generation (synthesis).
Responsibilities include, but are not limited to:
Develop and maintain design rule document by having various interactions with process integration, die design, scribe design and CMOS and array device groups.
Use DF2, Cadence, K2View, Vcats, to develop and debug the rules.
Interact with CAD to debug the rules and come up with sanity checks to understand the interaction with various mask and base layers.
Help in updating the logic of the generators by studying the sizing tables and Cailbre code.
Help in generating the Calibre code for the various sanity checks.
Perform DRC checks, layout vs. schematic and netlist extraction tools to ensure correctness in layout and also help in scribe test structures.
Interface with multiple other groups like Process Integration, Design Rules, CAD, Layout, Scribe and Mask shops with patience and thoroughness.
Drive diagnostic projects across multi-disciplinary teams to understand product and test structure failures and their interaction with layout and mask synthed data.
This position is associated with the sale of Intel's NAND memory and storagebusiness to SK Hynix (You can read more about the transaction in thepress release - ). The transaction will enhance the resources and potential ofthe business storagesolutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting timeto be at Intel - come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in theworld.As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell(QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.
This position aligns to Phase 2 of the transaction, which includesNAND technology and component development along withfab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology andcomponents and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix.
In-depth knowledge of semiconductor device and layout.
In-depth knowledge of DRC/LVS, can fix most DRC/LVS issues that come up work with the LVS/DRC maintenance group to build new models as needed.
Some understanding of generators and how they are related to process is helpful to fix any DRC/LVS issues.
In-depth knowledge of CAD tools and software, in particular DF2, K2view and Hercules.
Basic knowledge of device physics and parametric analysis.
Basic knowledge of photolithography and reticle creation.
Good verbal and written communication skills with Excel, Visio and Power Point proficiency.
Familiarity of Tape-out, OPC and Mask Generation Flows for High volume manufacturing.
Good understanding of GDS2/SF/OASIS format and layout hierarchy and layer maps.
Knowledge of DFII, K2VIEW and other Industry standard CD capture/measurement tools.
Proficient in English and ready to work with a team across multiple geographic zones.
Phd or MS with 3 years experienceInside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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