Construction TD Engineer

Construction TD Engineer

Intel
Not Specified
Not Specified

Job Description


Job Description :
Job Description
As a CS TD Facilities Engineer your responsibilities will include but are not limited to:
Provide Facilities engineering input to TD for process technology transfers in support of Safety, Reliability, Quality, Environmental and Cost objectives.
Work with TD to study the FOAK tool facility configuration to reduce the TI cost and facility BB and operation cost
Support EHS and PSM to select right EDB equipment to meet the environment compliance with lower facility construction and operation cost
Plan and lead new technology transfer, assess facility capacity gaps and enabling system.
Work with IE for Function area planning
Ensure systems operate reliably to avoid manufacturing and facility or environmental excursions, own system documentation and maintenance strategy.
Support Facilities technology and development.
Provide direct support and maintain periodic communication with key suppliers to ensure latest and most cost effective solutions are and technical accuracy is maintained in master specifications and standards.
Provide technical guidance to ensure compliance with safety, code, and Intel standards as well as study opportunities to reduce cost and improve schedule.
Provide transfer Support to facilities converting to new process technologies and ongoing technical guidance to sustaining facility teams to maintain and improve factory operations
Work collaboratively with group leaders, system owners and technicians to provide technical training and mentorship, engaging them in the learning process to grow team capability
Leading development of future expansion needs for facility systems
Provide technical and troubleshooting support to operations teams for processes and equipment.
Future performance validation against recipe and matching to projection tool.
Support EHS emissions model development and validation of current systems to work on future permit needs.
Work closely with the EHS modeling and projections groups to identify projection needs.
This position is associated with the sale of Intel's NAND memory and storage business to SK hynix. (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel - come join our Data Center NAND Division as a Construction TD Engineer and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Triple Level Cell (TLC) and Quadruple Level Cell (QLC) NAND Flash products. As a Construction TD Engineer, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Qualifications:
Candidate shall be at least Mechanical, chemical, electrical Engineering BS.
Additional qualifications include:
More than 20 years experience in semiconductor facility area.
Familiar with facility Mech, electrical, water, PSSS system and tool installation
Deep technical engineering knowledge with good analytical and problem solving skills.
Good ability to work independently and a good teamwork
High leadership and influence capabilities.
Good communication skills
Ability to work under pressure, and manage tasks based on priorities.
Customer orientation approach
Excellent verbal and written communication skills both in Mandarin and in English.
Knowledge and usage of Microsoft office and engineering design applications.Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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